ML

Melvin Levardo

Infineon Technologies Ag: 2 patents #3,160 of 7,486Top 45%
IN Intel: 2 patents #13,213 of 30,777Top 45%
📍 Carmona, PH: #1 of 3 inventorsTop 35%
Overall (All Time): #1,083,575 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
12308339 Method of manufacturing a package using a clip having at least one locking recess Ryan Ross Agbay Alinea, Markus Dinkel 2025-05-20
11728309 Clip having locking recess for connecting an electronic component with a carrier in a package Ryan Ross Agbay Alinea, Markus Dinkel 2023-08-15
6753613 Stacked dice standoffs Marcelo S. Gonzales 2004-06-22
6600222 Stacked microelectronic packages 2003-07-29