Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6942478 | Packaging mold with electrostatic discharge protection | Kuang-Lin Lo | 2005-09-13 |
| 6777793 | Packaging substrate with electrostatic discharge protection | Kuang-Lin Lo | 2004-08-17 |
| 6627481 | Method of manufacturing a semiconductor package with a lead frame having a support structure | Kuang-Lin Lo | 2003-09-30 |