Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12386245 | Off-axis light emitting device and image capturing module using the same | Yun-Ta Chen, MING-SHIOU TSAI, Yu-Yu Chang, Chien-Shun Huang | 2025-08-12 |
| 12274102 | Package structure | Wei-Te Cheng, KUO-MING CHIU, Kai-Chieh Liang, Jie-Ting Tsai | 2025-04-08 |
| 12072236 | Light sensing module and electronic device using the same | BO-JHIH CHEN, Zi-Jun Lin, KUO-MING CHIU, Yung-Chang Jen, Chang-Hung Hsieh | 2024-08-27 |
| 11916155 | Optoelectronic package having second encapsulant cover first encapsulant and photonic devices | Chien-Hsiu Huang, BO-JHIH CHEN, KUO-MING CHIU, Wei-Te Cheng, Kai-Chieh Liang +2 more | 2024-02-27 |
| 11644360 | Light sensing module and electronic device using the same | BO-JHIH CHEN, Zi-Jun Lin, KUO-MING CHIU, Yung-Chang Jen, Chang-Hung Hsieh | 2023-05-09 |
| 11522108 | Package structure | Wei-Te Cheng, KUO-MING CHIU, Kai-Chieh Liang, Jie-Ting Tsai | 2022-12-06 |
| 10916685 | Package structure and manufacturing method thereof | Wei-Te Cheng, KUO-MING CHIU, Kai-Chieh Liang | 2021-02-09 |
| 10756244 | LED package structure | KUO-MING CHIU, Hung-Jui Chen, Han-Hsing Peng | 2020-08-25 |
| 10720548 | Manufacturing method of LED package structure | Han-Hsing Peng, Heng-I Lee, KUO-MING CHIU | 2020-07-21 |
| 10686096 | Optical sensor module and a wearable device including the same | Tsan-Yu Ho, Chen-Hsiu Lin | 2020-06-16 |
| 10490693 | LED package structure and manufacturing method thereof | Han-Hsing Peng, Heng-I Lee, KUO-MING CHIU | 2019-11-26 |
| 10383528 | Wearable apparatus and photoplenthysmography sensor unit thereof | Tsan-Yu Ho, Ming-Kun Weng, Chiou-Yueh Wang, Fang-Yi Chang, Ren-Guey Lee +1 more | 2019-08-20 |
| 10326062 | UV LED package structure, UV light emitting unit, and method for manufacturing UV light emitting unit | KUO-MING CHIU, Han-Hsing Peng | 2019-06-18 |
| 10211360 | Optical biosensor module and method for making the same | Hung-Jui Chen, Tsan-Yu Ho | 2019-02-19 |
| 10134939 | Optical sensor module and a wearable device including the same | Tsan-Yu Ho, Chen-Hsiu Lin | 2018-11-20 |
| 9985191 | LED package structure | KUO-MING CHIU, Hung-Jui Chen, Han-Hsing Peng | 2018-05-29 |
| 9978915 | Manufacturing method of a flip-chip light emitting diode package module | Ming-Kun Weng | 2018-05-22 |
| 9812608 | Deep ultraviolet light-emitting diode chip and package structure containing the same | KUO-MING CHIU, Hao-Chung Kuo, Che-Yu Liu | 2017-11-07 |
| 9490404 | Flip-chip light emitting diode package module and manufacturing method thereof | Ming-Kun Weng | 2016-11-08 |
| 9441817 | Light-emitting structure | KUO-MING CHIU, Chen-Hsiu Lin | 2016-09-13 |
| 9412724 | Chip-scale packaged LED device | Ming-Kun Weng, KUO-MING CHIU, Shih-Chiang Yen, Chen-Hsiu Lin | 2016-08-09 |
| 9099625 | LED package and metallic frame thereof | Yi-Chien Chang, Chen-Hsiu Lin | 2015-08-04 |
| 9018648 | LED package structure | KUO-MING CHIU, TSUNG-CHI LEE, Chia-Hao Wu | 2015-04-28 |
| 8890439 | Light-emitting diode circuit and light-emitting device having the same | Wen-Hsiang Lin | 2014-11-18 |
| 8319245 | Lead frame, and light emitting diode module having the same | Shih-Chung Huang, Chen-Hsiu Lin | 2012-11-27 |