Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7358603 | High density electronic packages | Che-Yu Li | 2008-04-15 |
| 6546625 | Method of forming a contact member cable | Ai D. Le, John Lahlouh, Zhineng Fan, John Williams | 2003-04-15 |
| 6264476 | Wire segment based interposer for high frequency electrical connection | Che-Yu Li, Weimin Shi | 2001-07-24 |
| 5928005 | Self-assembled low-insertion force connector assembly | Che-Yu Li | 1999-07-27 |
| 5125016 | Procedure and measuring apparatus based on X-ray diffraction for measuring stresses | Veikko Lindroos | 1992-06-23 |