AL

Ai D. Le

HD High Connection Density: 9 patents #3 of 19Top 20%
Overall (All Time): #586,616 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6723927 High-reliability interposer for low cost and high reliability applications Zhineng Fan, Che-Yu Li 2004-04-20
6663399 Surface mount attachable land grid array connector and method of forming same Hassan Ali, Che-Yu Li, Zhineng Fan 2003-12-16
6638077 Shielded carrier with components for land grid array connectors Zhineng Fan, Che-Yu Li 2003-10-28
6590159 Compact stacked electronic package Zhineng Fan, Che-Yu Li 2003-07-08
6546625 Method of forming a contact member cable John Lahlouh, Zhineng Fan, Matti A. Korhonen, John Williams 2003-04-15
6471525 Shielded carrier for land grid array connectors and a process for fabricating same Zhineng Fan, Che-Yu Li 2002-10-29
6381164 Low profile, high density memory system Zhineng Fan, Che-Yu Li 2002-04-30
6370770 Carrier for land grid array connectors Zhineng Fan, Che-Yu Li 2002-04-16
6312266 Carrier for land grid array connectors Zhineng Fan, Che-Yu Li 2001-11-06