Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057362 | Semiconductor device and method for manufacturing semiconductor device | Osamu Miyata, Shingo Higuchi | 2024-08-06 |
| 11069591 | Semiconductor device and method for manufacturing semiconductor device | Osamu Miyata, Shingo Higuchi | 2021-07-20 |
| 10431516 | Semiconductor device and method for manufacturing semiconductor device | Osamu Miyata, Shingo Higuchi | 2019-10-01 |
| 9601441 | Semiconductor device and method for manufacturing semiconductor device | Osamu Miyata, Shingo Higuchi | 2017-03-21 |
| 9312228 | Semiconductor device and method for manufacturing semiconductor device | Osamu Miyata, Shingo Higuchi | 2016-04-12 |
| 9111819 | Semiconductor device and method for manufacturing semiconductor device | Osamu Miyata, Shingo Higuchi | 2015-08-18 |
| 9018762 | Semiconductor device bonding with stress relief connection pads | Hiroshi Okumura | 2015-04-28 |
| 8928156 | Semiconductor device and method for manufacturing semiconductor device | Osamu Miyata, Shingo Higuchi | 2015-01-06 |
| 8786106 | Semiconductor device and method for manufacturing semiconductor device | Osamu Miyata, Shingo Higuchi | 2014-07-22 |
| 8723339 | Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus | Osamu Miyata | 2014-05-13 |
| 8664779 | Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus | Osamu Miyata | 2014-03-04 |
| 8575764 | Semiconductor device and method for manufacturing semiconductor device | Osamu Miyata, Shingo Higuchi | 2013-11-05 |
| 8446008 | Semiconductor device bonding with stress relief connection pads | Hiroshi Okumura | 2013-05-21 |
| 8164201 | Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus | Osamu Miyata | 2012-04-24 |
| 7714448 | Semiconductor device and method for manufacturing semiconductor device | Osamu Miyata, Shingo Higuchi | 2010-05-11 |