Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6603871 | First-order authentication system | — | 2003-08-05 |
| 6470093 | First-order authentication system | — | 2002-10-22 |
| 6373965 | Apparatus and methods for authentication using partially fluorescent graphic images and OCR characters | — | 2002-04-16 |
| D453175 | Money checker | — | 2002-01-29 |
| 6057177 | Reinforced leadframe to substrate attachment | — | 2000-05-02 |
| 5905300 | Reinforced leadframe to substrate attachment | — | 1999-05-18 |
| 5867586 | Apparatus and methods for fluorescent imaging and optical character reading | — | 1999-02-02 |
| 5719948 | Apparatus and methods for fluorescent imaging and optical character reading | — | 1998-02-17 |
| 5714291 | System for authenticating printed or reproduced documents | Daniel A. Marinello, William McGinness | 1998-02-03 |
| 5666417 | Fluorescence authentication reader with coaxial optics | Daniel A. Marinello, William J. Ryan, Donald L. Wray | 1997-09-09 |
| 5605738 | Tamper resistant system using ultraviolet fluorescent chemicals | William McGinness | 1997-02-25 |
| 5574790 | Fluorescence authentication reader with coaxial optics | Daniel A. Marinello, William J. Ryan, David E. Silverglate, Donald L. Wray | 1996-11-12 |
| 5548106 | Methods and apparatus for authenticating data storage articles | Daniel A. Marinello, William J. Ryan | 1996-08-20 |
| 5532612 | Methods and apparatus for test and burn-in of integrated circuit devices | — | 1996-07-02 |
| 5442234 | Apparatus for thermally coupling a heat sink to a leadframe | — | 1995-08-15 |
| 5420758 | Integrated circuit package using a multi-layer PCB in a plastic package | — | 1995-05-30 |
| 5418855 | Authentication system and method | Daniel A. Marinello, William J. Ryan, Donald L. Wray | 1995-05-23 |
| 5414258 | Apparatus and method for calibration of fluorescence detectors | — | 1995-05-09 |
| 5414299 | Semi-conductor device interconnect package assembly for improved package performance | Tsing-Chow Wang | 1995-05-09 |
| 5387554 | Apparatus and method for thermally coupling a heat sink to a lead frame | — | 1995-02-07 |
| 5386141 | Leadframe having one or more power/ground planes without vias | Tsing-Chow Wang | 1995-01-31 |
| 5378924 | Apparatus for thermally coupling a heat sink to a lead frame | — | 1995-01-03 |
| 5365409 | Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe | Young I. Kwon | 1994-11-15 |
| 5359227 | Lead frame assembly and method for wiring same | Sang S. Lee | 1994-10-25 |
| 5350713 | Design and sealing method for semiconductor packages | — | 1994-09-27 |