LK

Leann G. Keim

IBM: 2 patents #32,839 of 70,183Top 50%
📍 Endicott, NY: #278 of 620 inventorsTop 45%
🗺 New York: #48,759 of 115,490 inventorsTop 45%
Overall (All Time): #2,298,785 of 4,157,543Top 60%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5176811 Gold plating bath additives for copper circuitization on polyimide printed circuit boards Ralph S. Paonessa, Daniel C. Van Hart 1993-01-05
5108562 Electrolytic method for forming vias and through holes in copper-invar-copper core structures Peter J. Duke, Krystyna W. Semkow 1992-04-28