Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436793 | Methods of forming semiconductor structure | Gary A. Kneezel, Daniel E. Kuhman, Brian T. Ormond, Ackerman C. John, Almon P. Fisher +1 more | 2002-08-20 |
| 5668061 | Method of back cutting silicon wafers during a dicing procedure | David J. Collins, Kevin A. Lindamood | 1997-09-16 |
| 5637388 | Layered resinoid/diamond blade for precision cutting operations and method of manufacturing same | Robert M. White, Robert P. Altavela, Alex S. Brougham, Robert A. Clingerman | 1997-06-10 |
| 5515089 | Ink jet printhead with sealed manifold and printhead die | Peter J. Nystrom | 1996-05-07 |
| 5506610 | Back side relief on thermal ink jet die assembly | Robert P. Altavela, Almon P. Fisher | 1996-04-09 |
| 5494698 | Teflon filled resinoid dicing blades for fabricating silicon die modules | Robert M. White, Robert P. Altavela | 1996-02-27 |
| 5408739 | Two-step dieing process to form an ink jet face | Robert P. Altavela, Almon P. Fisher | 1995-04-25 |
| 5306370 | Method of reducing chipping and contamination of reservoirs and channels in thermal ink printheads during dicing by vacuum impregnation with protective filler material | Robert P. Altavela, Joseph R. Weber, Robert M. White, Kathryn A. Wallace | 1994-04-26 |