| 12356743 |
Slanted glass edge for image sensor package |
David Gani |
2025-07-08 |
| 12322684 |
Method of manufacturing electronic devices and corresponding electronic device |
Roberto Tiziani |
2025-06-03 |
| 11942496 |
Slanted glass edge for image sensor package |
David Gani |
2024-03-26 |
| 11502029 |
Thin semiconductor chip using a dummy sidewall layer |
David Parker, David Gani |
2022-11-15 |
| 11193821 |
Ambient light sensor with light protection |
David Gani |
2021-12-07 |
| 10355146 |
Glue bleeding prevention cap for optical sensor packages |
Jing-En Luan, Yong Lei |
2019-07-16 |
| 10147834 |
Overmold proximity sensor and associated methods |
David Gani |
2018-12-04 |
| 10038108 |
Glue bleeding prevention cap for optical sensor packages |
Jing-En Luan, Yong Lei |
2018-07-31 |
| 9013017 |
Method for making image sensors using wafer-level processing and associated devices |
Yonggang Jin, WeeChinJudy Lim |
2015-04-21 |
| 8937774 |
Method for making paired lenses with an opaque barrier between, and product made |
— |
2015-01-20 |
| 7288843 |
Integrated circuit chip support substrate for placing in a mold, and associated method |
Christophe Prior |
2007-10-30 |
| 6087202 |
Process for manufacturing semiconductor packages comprising an integrated circuit |
Juan Exposito, Andrea Cigada |
2000-07-11 |