Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5758413 | Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias | Charles H. Crockett, Jr., Stephen Alan Dunn, deceased, Karl G. Hoebener, Michael G. McMaster | 1998-06-02 |
| 5699613 | Fine dimension stacked vias for a multiple layer circuit board structure | Charles H. Crockett, Jr., Stephen Alan Dunn, deceased, Karl G. Hoebener, Michael G. McMaster | 1997-12-23 |
| 5535936 | Fine pitch solder formation on printed circuit board process and product | Charles H. Crockett, Jr., Julian Partridge, Bhavyen S. Sanghavi | 1996-07-16 |
| 5493075 | Fine pitch solder formation on printed circuit board process and product | Charles H. Crockett, Jr., Julian Partridge, Bhavyen S. Sanghavi | 1996-02-20 |