| 6633663 |
Method and system for determining component dimensional information |
— |
2003-10-14 |
| 6425515 |
Method and apparatus for micro BGA removal and reattach |
Allen Thomas Mays, Michael C. Weller |
2002-07-30 |
| 6380494 |
Micro grid array solder interconnection structure with solder columns for second level packaging joining a module and printed circuit board |
Allen Thomas Mays, Michael C. Weller |
2002-04-30 |
| 6340111 |
Micro grid array solder interconnection structure for second level packaging joining a module and a printed circuit board |
Allen Thomas Mays, Michael C. Weller |
2002-01-22 |
| 6196439 |
Method and apparatus for .mu.BGA removal and reattach |
Allen Thomas Mays, Michael C. Weller |
2001-03-06 |
| 6059173 |
Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board |
Allen Thomas Mays, Michael C. Weller |
2000-05-09 |
| 6016949 |
Integrated placement and soldering pickup head and method of using |
— |
2000-01-25 |
