Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6890799 | Device for sealing and cooling multi-chip modules | Takahiro Daikoku, Kenichi Kasai, Toshitada Netsu, Takayuki Uda | 2005-05-10 |
| 6528878 | Device for sealing and cooling multi-chip modules | Takahiro Daikoku, Kenichi Kasai, Toshitada Netsu, Takayuki Uda | 2003-03-04 |