Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10870003 | Wearable alarm system for a prosthetic hearing implant | Brian Gordon, Charles Roger Aaron Leigh, Tadeusz Jurkiewicz | 2020-12-22 |
| 9630006 | Wearable alarm system for a prosthetic hearing implant | Brian Gordon, Roger Leigh, Tadeusz Jurkiewicz | 2017-04-25 |
| 8293589 | Wire bond encapsulant control method | Laval Chung-Long-Shan, Kia Silverbrook | 2012-10-23 |
| 8063318 | Electronic component with wire bonds in low modulus fill encapsulant | Susan Williams, Laval Chung-Long-Shan | 2011-11-22 |
| 8039974 | Assembly of electronic components | Kia Silverbrook, Laval Chung-Long-Shan | 2011-10-18 |
| 8025204 | Method of wire bond encapsulation profiling | Laval Chung-Long-Shan, Kia Silverbrook | 2011-09-27 |
| 8017450 | Method of forming assymetrical encapsulant bead | Nadine Lee-Yen Chew, Elmer Dimaculangan Perez | 2011-09-13 |
| 7988033 | Method of reducing wire bond profile height in integrated circuits mounted to circuit boards | Laval Chung-Long-Shan, Kia Silverbrook | 2011-08-02 |
| 7946465 | Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards | Kia Silverbrook, Laval Chung-Long-Shan | 2011-05-24 |
| 7915091 | Method of controlling satellite drops from an encapsulant jetter | Nadine Lee-Yen Chew, Elmer Dimaculangan Perez | 2011-03-29 |
| 7875504 | Method of adhering wire bond loops to reduce loop height | Kia Silverbrook, Laval Chung-Long-Shan | 2011-01-25 |
| 7824013 | Integrated circuit support for low profile wire bond | Laval Chung-Long-Shan, Kia Silverbrook | 2010-11-02 |
| 7802715 | Method of wire bonding an integrated circuit die and a printed circuit board | Kia Silverbrook, Laval Chung-Long-Shan | 2010-09-28 |
| 7803659 | Method of encapsulating wire bonds | Laval Chung-Long-Shan, Kia Silverbrook | 2010-09-28 |
| 7741720 | Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards | Kia Silverbrook, Laval Chung-Long-Shan | 2010-06-22 |
| 7669751 | Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards | Kia Silverbrook, Laval Chung-Long-Shan | 2010-03-02 |
| 7659141 | Wire bond encapsulant application control | Laval Chung-Long-Shan, Kia Silverbrook | 2010-02-09 |
| 7618842 | Method of applying encapsulant to wire bonds | Laval Chung-Long-Shan, Kia Silverbrook | 2009-11-17 |
| 7571006 | Wearable alarm system for a prosthetic hearing implant | Brian Gordon, Roger Leigh, Tadeusz Jurkiewicz | 2009-08-04 |