Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8931148 | Method of making a three-dimensional fiber preform for fabricating an annular part out of carbon/carbon composite material | Vincent Delecroix | 2015-01-13 |
| 8568838 | Power control for densification of one or more porous articles | Bruce Zimmerman, Arnaud Fillion | 2013-10-29 |
| 8569188 | One piece shim | — | 2013-10-29 |
| 8133532 | Method of densifying porous articles | Patrick Loisy, Yvan Baudry | 2012-03-13 |
| 7145234 | Circuit carrier and package structure thereof | Chi-Hsing Hsu | 2006-12-05 |
| 7060134 | One piece shim | — | 2006-06-13 |
| 7038309 | Chip package structure with glass substrate | Chi-Hsing Hsu | 2006-05-02 |
| 6965169 | Hybrid integrated circuit package substrate | Shelton Lu | 2005-11-15 |
| 6909187 | Conductive wiring layer structure | Yuangtsang Liaw, Hung-Yin Tsai | 2005-06-21 |
| 6680544 | Flip-chip bump arrangement for decreasing impedance | Hsueh-Chung Shelton Lu, Jimmy Huang | 2004-01-20 |
| D382115 | Tool box | — | 1997-08-12 |
| D367557 | Tool box | — | 1996-03-05 |