Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538963 | III-V light emitting device having low Si—H bonding dielectric layers for improved P-side contact performance | Jeonghyuk Park, Gregory Batinica, Andrew Teren, Clarence Crouch, Qian Fan +1 more | 2022-12-27 |
| 11495714 | Device and method for III-V light emitting micropixel array device having hydrogen diffusion barrier layer | Hussein S. El-Ghoroury, Andrew Teren, Qian Fan | 2022-11-08 |
| 11476390 | III-V light emitting device with pixels enabling lower cost through-layer vias | Hussein S. El-Ghoroury, Qian Fan | 2022-10-18 |
| 11195975 | Device and method for III-V light emitting micropixel array device having hydrogen diffusion barrier layer | Hussein S. El-Ghoroury, Andrew Teren, Qian Fan | 2021-12-07 |
| 10373830 | Apparatus and methods to remove unbonded areas within bonded substrates using localized electromagnetic wave annealing | Hussein S. El-Ghoroury, Minghsuan Liu, Weilong Tang, Benjamin A. Haskell, Hailong Zhou | 2019-08-06 |
| 9978582 | Methods for improving wafer planarity and bonded wafer assemblies made from the methods | Gregory Batinica, Qian Fan, Benjamin A. Haskell, Hussein S. El-Ghoroury | 2018-05-22 |
| 9306116 | Semiconductor wafer bonding incorporating electrical and optical interconnects | Hussein S. El-Ghoroury, Chih-Li Chuang, Qian Fan | 2016-04-05 |
| 8912017 | Semiconductor wafer bonding incorporating electrical and optical interconnects | Hussein S. El-Ghoroury, Chih-Li Chuang, Qian Fan | 2014-12-16 |