Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12015246 | Vertical cavity surface emitting laser and corresponding fabricating method | Xianfeng Ni, Bin Hua, Ying Cui | 2024-06-18 |
| 11974698 | Food processor, and power supply board assembly and base for food processor | Guohua Luo, Yunxiang Liu | 2024-05-07 |
| 11602243 | Food processor | Xianghe Zeng, Jianfei Xu | 2023-03-14 |
| 11538963 | III-V light emitting device having low Si—H bonding dielectric layers for improved P-side contact performance | Kameshwar Yadavalli, Jeonghyuk Park, Gregory Batinica, Andrew Teren, Clarence Crouch +1 more | 2022-12-27 |
| 11532739 | Integrated enhancement/depletion mode HEMT and method for manufacturing the same | Xianfeng Ni, Wei He | 2022-12-20 |
| 11495714 | Device and method for III-V light emitting micropixel array device having hydrogen diffusion barrier layer | Hussein S. El-Ghoroury, Kameshwar Yadavalli, Andrew Teren | 2022-11-08 |
| 11476390 | III-V light emitting device with pixels enabling lower cost through-layer vias | Hussein S. El-Ghoroury, Kameshwar Yadavalli | 2022-10-18 |
| 11195975 | Device and method for III-V light emitting micropixel array device having hydrogen diffusion barrier layer | Hussein S. El-Ghoroury, Kameshwar Yadavalli, Andrew Teren | 2021-12-07 |
| 11056572 | Semiconductor device and method for manufacturing the same | Xianfeng Ni, Wei He | 2021-07-06 |
| 11049943 | Method for forming III-nitride semiconductor device and the III-nitride semiconductor device | Xian-Feng Ni, Wei He | 2021-06-29 |
| 11049952 | Integrated enhancement/depletion mode HEMT | Xianfeng Ni, Wei He | 2021-06-29 |
| 11049718 | Fabrication of group III-nitride semiconductor devices | Xian-Feng Ni, Wei He | 2021-06-29 |
| 10879063 | Method for fabricating high-quality and high-uniformity III-nitride epi structure | Xianfeng Ni, Wei He | 2020-12-29 |
| 10786117 | Food processor | Xianghe Zeng, Jianfei Xu | 2020-09-29 |
| 10784366 | Integrated enhancement/depletion mode HEMT and method for manufacturing the same | Xianfeng Ni, Wei He | 2020-09-22 |
| 10777653 | Method for manufacturing an integrated enhancement/depletion mode HEMT | Xianfeng Ni, Wei He | 2020-09-15 |
| 10777654 | Method for manufacturing nitrogen-face polarity gallium nitride epitaxial structure | Xianfeng Ni, Wei He | 2020-09-15 |
| 10763174 | Method for recovering carbon-face-polarized silicon carbide substrate | Xianfeng Ni, Wei He | 2020-09-01 |
| 10749020 | Group III-nitride semiconductor device and corresponding fabricating method | Xian-Feng Ni, Wei He | 2020-08-18 |
| 10727053 | Method of fabricating semiconductor structure | Xianfeng Ni, Wei He | 2020-07-28 |
| 10622456 | Semiconductor device and method for manufacturing the same | Xianfeng Ni, Wei He | 2020-04-14 |
| 9978582 | Methods for improving wafer planarity and bonded wafer assemblies made from the methods | Gregory Batinica, Kameshwar Yadavalli, Benjamin A. Haskell, Hussein S. El-Ghoroury | 2018-05-22 |
| 9306116 | Semiconductor wafer bonding incorporating electrical and optical interconnects | Hussein S. El-Ghoroury, Chih-Li Chuang, Kameshwar Yadavalli | 2016-04-05 |
| 8912017 | Semiconductor wafer bonding incorporating electrical and optical interconnects | Hussein S. El-Ghoroury, Chih-Li Chuang, Kameshwar Yadavalli | 2014-12-16 |