Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288835 | Electronic device comprising an optical chip and method of fabrication | Nicolas MASTROMAURO | 2025-04-29 |
| 12066678 | Method of fabricating an electronic device comprising an optical chip | Nicolas MASTROMAURO, Roy Duffy | 2024-08-20 |
| 11974419 | Method, systems, and apparatuses for electromagnetic shielding | Florian PERMINJAT, Etienne Brosse | 2024-04-30 |
| 11688815 | Method for manufacturing a cover for an electronic package and electronic package comprising a cover | Alexandre Mas, Eric Saugier, Gaetan Lobascio, Benoit Besancon | 2023-06-27 |
| 11664475 | Electronic device comprising a carrier substrate and an encapsulating cover mounted on the carrier substrate, and corresponding mounting process | Nicolas MASTROMAURO | 2023-05-30 |
| 11609402 | Electronic device comprising an optical chip and method of fabrication | Nicolas MASTROMAURO, Roy Duffy | 2023-03-21 |
| 11546059 | Cover for an electronic circuit package | Jean-Michel Riviere, Romain Coffy | 2023-01-03 |
| 11437527 | Encapsulation cover for an electronic package and fabrication process | Veronique FERRE, Agnes BAFFERT, Jean-Michel Riviere | 2022-09-06 |
| 11244910 | Method for fabricating an electronic device comprising forming an infused adhesive and a periperal ring | Marika Sorrieul | 2022-02-08 |
| 11114312 | Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover | Benoit Besancon, Alexandre Mas | 2021-09-07 |
| 10998470 | Cover for an electronic circuit package | Jean-Michel Riviere, Romain Coffy | 2021-05-04 |
| 10965376 | Cover for an electronic circuit package | Jean-Michel Riviere, Romain Coffy | 2021-03-30 |
| 10923638 | Electronic device comprising an optical chip and method of fabrication | Nicolas MASTROMAURO | 2021-02-16 |
| 10833208 | Method for manufacturing a cover for an electronic package and electronic package comprising a cover | Alexandre Mas, Eric Saugier, Gaetan Lobascio, Benoit Besancon | 2020-11-10 |
| 10748883 | Encapsulation cover for an electronic package and method of fabrication | Jean-Michel Riviere | 2020-08-18 |
| 10672721 | Method for fabricating an electronic device and a stacked electronic device | Marika Sorrieul | 2020-06-02 |
| 10480994 | Electronic housing including a grooved cover | Jean-Michel Riviere | 2019-11-19 |
| 10483408 | Method for making a cover for an electronic package and electronic package comprising a cover | Alexandre Mas, Eric Saugier, Gaetan Lobascio, Benoit Besancon | 2019-11-19 |
| 10483181 | Electronic package and fabrication method | Nicolas MASTROMAURO | 2019-11-19 |
| 10325784 | Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover | Benoit Besancon, Alexandre Mas | 2019-06-18 |
| 10177098 | Method for fabricating an electronic device and a stacked electronic device | Marika Sorrieul | 2019-01-08 |
| 9773740 | Stacked electronic device including a protective wafer bonded to a chip by an infused adhesive | Marika Sorrieul | 2017-09-26 |
| 9472692 | Process of fabrication of electronic devices and electronic device with a double encapsulation ring | Marika Sorrieul | 2016-10-18 |
| 9420685 | Electronic device comprising a substrate board equipped with a local reinforcing or balancing layer | Jean-Michel Riviere | 2016-08-16 |
| 9101077 | Electronic component package with a heat conductor | Jean-Michel Riviere | 2015-08-04 |