Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004780 | Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro | Shreepad Amar Panth, Yang Du, Robert P. Gilmore | 2021-05-11 |
| 10510651 | Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro | Shreepad Amar Panth, Yang Du, Robert P. Gilmore | 2019-12-17 |
| 10192813 | Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro | Shreepad Amar Panth, Yang Du, Robert P. Gilmore | 2019-01-29 |
| 10176147 | Multi-processor core three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods | Amin Ansari, Yang Du | 2019-01-08 |
| 10121743 | Power distribution networks for a three-dimensional (3D) integrated circuit (IC) (3DIC) | Pratyush Kamal, Jing Xie, Yang Du | 2018-11-06 |
| 9929733 | Connection propagation for inter-logical block connections in integrated circuits | Pratyush Kamal, Jing Xie, Yang Du | 2018-03-27 |
| 9754923 | Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs) | Jing Xie, Pratyush Kamal, Yang Du, Javid Jaffari | 2017-09-05 |
| 9741691 | Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC) | Sung Kyu Lim, Yang Du | 2017-08-22 |
| 9629233 | Techniques for implementing a synthetic jet to cool a device | Mehdi Saeidi, Arpit Mittal, Emil Rahim, Rajat Mittal | 2017-04-18 |
| 9626311 | Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms | Sung Kyu Lim, Karamvir CHATHA, Yang Du | 2017-04-18 |
| 9508615 | Clock tree synthesis for low cost pre-bond testing of 3D integrated circuits | Sung Kyu Lim, Pratyush Kamal, Yang Du | 2016-11-29 |
| 9483598 | Intellectual property block design with folded blocks and duplicated pins for 3D integrated circuits | Sung Kyu Lim, Yang Du | 2016-11-01 |
| 9147438 | Monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) with vertical memory components, related systems and methods | Pratyush Kamal, Yang Du | 2015-09-29 |
| 9123721 | Placement of monolithic inter-tier vias (MIVs) within monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) using clustering to increase usable whitespace | Shreepad Amar Panth, Pratyush Kamal, Yang Du | 2015-09-01 |
| 9098666 | Clock distribution network for 3D integrated circuit | Shreepad Amar Panth, Jing Xie, Yang Du | 2015-08-04 |
| 9064077 | 3D floorplanning using 2D and 3D blocks | Shreepad Amar Panth, Yang Du | 2015-06-23 |
| 9041448 | Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC) (3DIC) and related methods | Yang Du, Jing Xie | 2015-05-26 |