Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637539 | Surface acoustic wave device package and method of manufacturing the same | Jung-Hoon Han, Bong-Soo Kim, Eun Tae Park | 2023-04-25 |
| 10446506 | Wafer level package and manufacturing method thereof | Jung-Hoon Han, Eun Tae Park, Jin-Ho Ha | 2019-10-15 |