| 12424502 |
Integrated circuit package with heat transfer chimney including thermally conductive nanoparticles |
Bomy Chen |
2025-09-23 |
| 12205910 |
Integrated circuit bond pad with multi-material toothed structure |
Bomy Chen, Yaojian Leng, Gerald Marsico, Julius Kovats |
2025-01-21 |
| 12205885 |
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring |
Yaojian Leng |
2025-01-21 |
| 12040282 |
Electronic device including interposers bonded to each other |
Bomy Chen, Anu Ramamurthy, Julius Kovats |
2024-07-16 |
| 11935824 |
Integrated circuit package module including a bonding system |
Bomy Chen, Yaojian Leng, Julius Kovats |
2024-03-19 |
| 11735516 |
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring |
Yaojian Leng |
2023-08-22 |
| 11723222 |
Integrated circuit (IC) package with integrated inductor having core magnetic field (B field) extending parallel to substrate |
Yaojian Leng, Bomy Chen |
2023-08-08 |
| 11715757 |
Three-dimensional metal-insulator-metal (MIM) capacitor |
Yaojian Leng |
2023-08-01 |
| 11682642 |
Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond |
Bomy Chen, Andrew Taylor |
2023-06-20 |
| 11682641 |
Integrated circuit bond pad with multi-material toothed structure |
Bomy Chen, Yaojian Leng, Gerald Marsico, Julius Kovats |
2023-06-20 |
| 11670583 |
Integrated inductor with a stacked metal wire |
Yaojian Leng |
2023-06-06 |
| 11626474 |
Thin-film resistor (TFR) with improved contacts |
Yaojian Leng |
2023-04-11 |
| 11545544 |
Three-dimensional metal-insulator-metal (MIM) capacitor |
Yaojian Leng |
2023-01-03 |