Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394747 | Curved wafer stage | Gijs van der Veen, Jasper Wesselingh, Patrick Houben | 2025-08-19 |
| 10998804 | Device, apparatus and system | Tom Kampschreur, Nailia Nasibulina | 2021-05-04 |
| 8474680 | Wirebonding method and apparatus | Thomas Markus Kampschreur, Arjan Franklin Bakker, Piet C. J. Van Rens, Arnoldus J. C. B. De Vet, Piet Van Der Meer | 2013-07-02 |
| 7726011 | Chip transfer method and apparatus | Johannes Wilhelmus Dorotheus Bosch, Wilhelmus Johannus Theodorus Derks, Antonius Hendrikus Jozef Kamphuis, Thomas Markus Kampschreur, Leon Wetzels | 2010-06-01 |
| 7677523 | Gravity compensation device for a chip transfer apparatus | — | 2010-03-16 |
| 7578425 | Wirebonding method and apparatus | Thomas Markus Kampschreur, Arjan Franklin Bakker, Piet C. J. Van Rens, Arnoldus J. C. B. De Vet, Piet Van Der Meer | 2009-08-25 |