| 10115605 |
Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates |
Richard J. Ross, Raymond J. Bregante, Biao Fu, Michael Bregante, Cresencio Amparo |
2018-10-30 |
| 8759965 |
Modular low stress package technology |
Craig J. Rotay, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross |
2014-06-24 |
| 8639373 |
Modular low stress package technology |
Craig J. Rotay, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross |
2014-01-28 |
| 8560104 |
Modular low stress package technology |
Craig J. Rotay, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross |
2013-10-15 |
| 8283769 |
Modular low stress package technology |
Craig J. Rotay, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross |
2012-10-09 |
| 8153474 |
Modular low stress package technology |
Craig J. Rotay, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross |
2012-04-10 |
| 6214152 |
Lead frame moisture barrier for molded plastic electronic packages |
Richard J. Ross, Cynthia L. Ross, Tony B. Shaffer |
2001-04-10 |