Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8197300 | Simultaneous double-side grinding of semiconductor wafers | Robert Weiss | 2012-06-12 |
| 7666064 | Method for grinding semiconductor wafers | Robert Weiss | 2010-02-23 |
| 6997779 | Device for the simultaneous double-side grinding of a workpiece in wafer form | Robert Weiss | 2006-02-14 |
| 6390896 | Method and device for cutting a multiplicity of disks from a hard brittle workpiece | Anton Huber, Jorg Moser | 2002-05-21 |
| 5030910 | Method and apparatus for slicing crystalline wafers aided by magnetic field monitoring means | Johann Glas, Johann Niedermeier, Gerhard Brehm | 1991-07-09 |