Issued Patents All Time
Showing 1–25 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195659 | Plated terminations | Andrew P. Ritter, Robert H. Heistand, II, Sriram Dattaguru | 2021-12-07 |
| 10366835 | Plated terminations | Andrew P. Ritter, Robert H. Heistand, II, Sriram Dattaguru | 2019-07-30 |
| 10020116 | Plated terminations | Andrew P. Ritter, Robert H. Heistand, II, Sriram Dattaguru | 2018-07-10 |
| 9666366 | Method of making multi-layer electronic components with plated terminations | Andrew P. Ritter, Robert H. Heistand, II, Sriram Dattaguru | 2017-05-30 |
| 8605411 | Abrasive blasted conductive polymer cathode for use in a wet electrolytic capacitor | Martin Biler, Dirk H. Dreissig, Zebbie Lynn Sebald, Frantisek Priban | 2013-12-10 |
| 8514547 | Volumetrically efficient wet electrolytic capacitor | Tomas Karnik, James Steven Bates, Richard Baker, Dirk H. Dreissig, Andrew P. Ritter | 2013-08-20 |
| 8446705 | Ultra broadband capacitor | Andrew P. Ritter, John Mruz, Robert Grossbach, Marianne Berolini | 2013-05-21 |
| 8405956 | High voltage electrolytic capacitors | Dirk H. Dreissig | 2013-03-26 |
| 8259435 | Hermetically sealed wet electrolytic capacitor | William A. Millman, Ed Jackson, James Steven Bates | 2012-09-04 |
| 8223473 | Electrolytic capacitor containing a liquid electrolyte | Dirk H. Dreissig | 2012-07-17 |
| 7889020 | Asymmetrical filter | Joseph M. Hock | 2011-02-15 |
| 7832618 | Termination bonding | Thomas J. Brown | 2010-11-16 |
| 7724496 | Multilayer vertically integrated array technology | Carl L. Eggerding, Ronald S. Demcko | 2010-05-25 |
| 7697262 | Multilayer ceramic capacitor with internal current cancellation and bottom terminals | Andrew P. Ritter | 2010-04-13 |
| 7576968 | Plated terminations and method of forming using electrolytic plating | Andrew P. Ritter, Robert H. Heistand, II, John M. Hulik, Raymond T. Galasco | 2009-08-18 |
| 7573698 | Window via capacitors | Carl L. Eggerding, Jason MacNeal, Andrew P. Ritter | 2009-08-11 |
| 7463474 | System and method of plating ball grid array and isolation features for electronic components | Andrew P. Ritter, Raymond T. Galasco | 2008-12-09 |
| 7414857 | Multilayer ceramic capacitor with internal current cancellation and bottom terminals | Andrew P. Ritter | 2008-08-19 |
| 7344981 | Plated terminations | Andrew P. Ritter, Robert H. Heistand, II, Sriram Dattaguru, Jeffrey A. Horn, Richard Ladew | 2008-03-18 |
| 7263764 | Method for adjusting performance characteristics of a multilayer component | Robert H. Heistand, II, Georghe Korony | 2007-09-04 |
| 7177137 | Plated terminations | Andrew P. Ritter, Robert H. Heistand, II, Sriram Dattaguru, Jeffrey A. Horn, Richard Ladew | 2007-02-13 |
| 7170737 | Window via capacitor | Jason MacNeal, Andrew P. Ritter | 2007-01-30 |
| 7161794 | Component formation via plating technology | Jason MacNeal, Andrew P. Ritter, Robert H. Heistand, II, Sriram Dattaguru | 2007-01-09 |
| 7152291 | Method for forming plated terminations | Andrew P. Ritter, Robert H. Heistand, II, Sriram Dattaguru | 2006-12-26 |
| 7154374 | Plated terminations | Andrew P. Ritter, Robert H. Heistand, II, Sriram Dattaguru | 2006-12-26 |