| 8088246 |
Process for improving the adhesion of polymeric materials to metal surfaces |
Kesheng Feng, Steven A. Castaldi, Colleen Mckirryher |
2012-01-03 |
| 7704562 |
Process for improving the adhesion of polymeric materials to metal surfaces |
— |
2010-04-27 |
| 5289630 |
Process for fabricating multilayer printed circuits |
Donald Ferrier, Donald P. Cullen, Edward Donlon, Gary B. Larson, William J. Decesare |
1994-03-01 |
| 5261154 |
Process for fabricating multilayer printed circuits |
Donald Ferrier, Donald P. Cullen, Edward Donlon, Gary B. Larson, William J. Decesare +1 more |
1993-11-16 |
| 5248398 |
Process for direct electrolytic regeneration of chloride-based ammoniacal copper etchant bath |
— |
1993-09-28 |
| 5234542 |
Composition and process for stripping tin from copper surfaces |
— |
1993-08-10 |
| 5221418 |
Method for improving the surface insulation resistance of printed circuits |
— |
1993-06-22 |
| 5207867 |
Composition and method for improving the surface insulation resistance of a printed circuit |
— |
1993-05-04 |
| 5085730 |
Process for regenerating ammoniacal chloride etchants |
— |
1992-02-04 |
| 5017267 |
Composition and method for stripping tin or tin-lead alloy from copper surfaces |
— |
1991-05-21 |
| 4957653 |
Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy |
— |
1990-09-18 |
| 4944851 |
Electrolytic method for regenerating tin or tin-lead alloy stripping compositions |
Raymond A. Letize |
1990-07-31 |
| 4784785 |
Copper etchant compositions |
Raymond A. Letize |
1988-11-15 |
| 4775444 |
Process for fabricating multilayer circuit boards |
— |
1988-10-04 |