Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373939 | Quad leadframe packages and related methods | Asif Y. Jakwani, Chee Hiong CHEW, Yusheng LIN, Sravan VANAPARTHY, Silnore Tejero SABANDO | 2022-06-28 |
| 10438932 | Semiconductor device and method of integrating power module with interposer and opposing substrates | Yusheng LIN, Mingjiao Liu | 2019-10-08 |
| 9972607 | Semiconductor device and method of integrating power module with interposer and opposing substrates | Yusheng LIN, Mingjiao Liu | 2018-05-15 |