Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7667303 | Multi-chip package | Sheng-Hsiung Chen | 2010-02-23 |
| 6946601 | Electronic package with passive components | I-Tseng Lee | 2005-09-20 |
| 6919628 | Stack chip package structure | I-Tseng Lee, Hsueh-Kuo Liao | 2005-07-19 |