Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862603 | Semiconductor packages with chips partially embedded in adhesive | Taewook Kim, Jongho Lee, Hyeon Hwang | 2024-01-02 |
| 11670556 | Semiconductor package | — | 2023-06-06 |
| 11158550 | Semiconductor package | — | 2021-10-26 |