Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7768108 | Semiconductor die package including embedded flip chip | Yong Liu, Zhongfa Yuan, Roger Luo | 2010-08-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7768108 | Semiconductor die package including embedded flip chip | Yong Liu, Zhongfa Yuan, Roger Luo | 2010-08-03 |