Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276615 | Semiconductor device package with a cap to selectively exclude contact with mold compound | Laura May Antoinette Dela Paz Clemente | 2022-03-15 |
| 10811292 | Transport packaging and method for expanded wafers | Connie Alagadan Esteron, Dolores Babaran Milo | 2020-10-20 |
| 10615075 | Dicing a wafer | Jeniffer Otero Aspuria, Julian Carlo Barbadillo, Alvin Lopez Andaya | 2020-04-07 |
| 10418294 | Semiconductor device package with a cap to selectively exclude contact with mold compound | Laura May Antoinette Dela Paz Clemente | 2019-09-17 |
| 9997490 | Window clamp | Ruby Ann Maya Merto, Edsel Gomez Balagtas | 2018-06-12 |
| 9824959 | Structure and method for stabilizing leads in wire-bonded semiconductor devices | Dolores Babaran Milo, Mark Gerald Rosario Pinlac, Bobby Johns Lansangan Villacarlos, Juan Carlo Aro Rimando | 2017-11-21 |
| 8716845 | Lead frame strip for reduced mold sticking during degating | Norbert Joson Santos, Edgar Dorotayo Balidoy, Anthony Steven Dominisac Panagan, Ferdinand S. Signey | 2014-05-06 |
| 7476960 | System and method for improved auto-boating | Mark Cruz, Edward De la Rosa | 2009-01-13 |
| 7402893 | System and method for improved auto-boating | Mark Cruz | 2008-07-22 |
| 7358617 | Bond pad for ball grid array package | Mark Cruz, Ma. Celine Ramirez Mandapat | 2008-04-15 |
| 7127794 | Auto-boating process | Mark Cruz, Edward De la Rosa | 2006-10-31 |