Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8220685 | System for breaking a semiconductor wafer or other workpiece along a scribe line | Paul C. Lindsey, Jr., Christopher Lindsey | 2012-07-17 |
| 7392732 | Scribing tool and method | Paul C. Lindsey, Jr., Christopher Lindsey | 2008-07-01 |
| 6826840 | Semiconductor wafer scribing system | Paul C. Lindsey, Jr. | 2004-12-07 |