JP

Jason Pittam

Micron: 1 patents #4,761 of 6,345Top 80%
Overall (All Time): #3,488,199 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6781248 Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged Chong Chin Hui, Lee Kian Chai 2004-08-24