JP

Jason J. Payne

TE Teradyne: 5 patents #53 of 581Top 10%
AM Amphenol: 3 patents #112 of 392Top 30%
Overall (All Time): #657,997 of 4,157,543Top 20%
8
Patents All Time

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDate
7508681 Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics Mark W. Gailus, Leon Khilchenko, Huilin Ren 2009-03-24
7242592 Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics Mark W. Gailus, Leon Khilchenko, Huilin Ren 2007-07-10
7074086 High speed, high density electrical connector Thomas S. Cohen, Marc B. Cartier, Jr., John Robert Dunham 2006-07-11
6872085 High speed, high density electrical connector assembly Thomas S. Cohen, Marc B. Cartier, Jr., John Robert Dunham 2005-03-29
6827611 Electrical connector with multi-beam contact Thomas S. Cohen, John Robert Dunham, Mark W. Gailus, Philip T. Stokoe 2004-12-07
6814619 High speed, high density electrical connector and connector assembly Philip T. Stokoe, Neil Bacon, Huilin Ren 2004-11-09
6780059 High speed, high density electrical connector Huilin Ren, Philip T. Stokoe 2004-08-24
6776659 High speed, high density electrical connector Philip T. Stokoe, Huilin Ren 2004-08-17