Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5859387 | Semiconductor device leadframe die attach pad having a raised bond pad | — | 1999-01-12 |
| 5289344 | Integrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink means | Paul Panaccione | 1994-02-22 |
| 5012322 | Semiconductor die and mounting assembly | Paul A. Guillotte, Paul Panaccione, Thomas J. Martiska | 1991-04-30 |
| 4916506 | Integrated-circuit lead-frame package with low-resistance ground-lead and heat-sink means | — | 1990-04-10 |