Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7842547 | Laser lift-off of sapphire from a nitride flip-chip | Bryan Shelton, Sebastien Libon | 2010-11-30 |
| 7667236 | Optimized contact design for thermosonic bonding of flip-chip devices | Hari Venugopalan, Xiang Gao, Michael Sackrison | 2010-02-23 |
| 7635869 | Support with recessed electrically conductive chip attachment material for flip-chip bonding a light emitting chip | Boris Kolodin, Michael Hsing, Stanton Earl Weaver, Srinath K. Aanegola | 2009-12-22 |
| 7456035 | Flip chip light emitting diode devices having thinned or removed substrates | Boris Kolodin, Emil P. Stefanov | 2008-11-25 |
| 7358539 | Flip-chip light emitting diode with indium-tin-oxide based reflecting contacts | Hari Venugopalan | 2008-04-15 |
| 7285801 | LED with series-connected monolithically integrated mesas | Chris Bohler, Bryan Shelton, Hari Venugopalan, Xiang Gao | 2007-10-23 |
| 7190005 | GaN LED with solderable backside metal | Shawn R. Gibb, Robert F. Karlicek, Jr., Prosanto K. Mukerji, Hari Venugopalan | 2007-03-13 |
| 7179670 | Flip-chip light emitting diode device without sub-mount | Bryan Shelton, Sebastien Libon, Hari Venugopalan, Stanton Earl Weaver, Chen-Lun Hsing Chen +3 more | 2007-02-20 |
| 7115896 | Semiconductor structures for gallium nitride-based devices | Shiping Guo, David W. Gotthold, Milan Pophristic, Boris Peres, Bryan Shelton +3 more | 2006-10-03 |
| 7087463 | Laser separation of encapsulated submount | Michael Sackrison, Xiang Gao, Bryan Shelton | 2006-08-08 |
| 7084475 | Lateral conduction Schottky diode with plural mesas | Bryan Shelton, Linlin Liu, Alex Ceruzzi, Michael Murphy, Milan Pophristic +3 more | 2006-08-01 |
| 7078319 | Laser separated die with tapered sidewalls for improved light extraction | Mark Gottfried | 2006-07-18 |
| 7064356 | Flip chip light emitting diode with micromesas and a conductive mesh | Emil P. Stefanov, Hari Venugopalan, Bryan Shelton | 2006-06-20 |
| 7023022 | Microelectronic package having improved light extraction | Robert F. Karlicek, Jr., Hari Venugopalan | 2006-04-04 |
| 7015516 | Led packages having improved light extraction | Robert F. Karlicek, Jr., Hari Venugopalan | 2006-03-21 |
| 6964877 | LED power package | Chen-Lun Hsing Chen, Stanton Earl Weaver, Sebastien Libon, Mehmet Arik, David Mulford Shaddock | 2005-11-15 |
| 6958498 | Optimized contact design for flip-chip LED | Bryan Shelton, Hari Venugopalan | 2005-10-25 |
| 6902990 | Semiconductor device separation using a patterned laser projection | Mark Gottfried, Michael Gregory Brown, Robert F. Karlicek, Jr., James Nering | 2005-06-07 |
| 6849524 | Semiconductor wafer protection and cleaning for device separation using laser ablation | Bryan Shelton, Mark Gottfried, Stephen Schwed | 2005-02-01 |
| 6787435 | GaN LED with solderable backside metal | Shawn R. Gibb, Robert F. Karlicek, Jr., Prosanto K. Mukerji, Hari Venugopalan | 2004-09-07 |
| 6746889 | Optoelectronic device with improved light extraction | Hari Venugopalan, Bob Karlicek, Stanton Earl Weaver | 2004-06-08 |
| 6661167 | LED devices | Mathew Sommers, Stanton Earl Weaver | 2003-12-09 |
| 6653215 | Contact to n-GaN with Au termination | Michael Gregory Brown, Keng Ouyang, Hari Venugopalan | 2003-11-25 |
| 6642548 | Light-emitting diodes with loop and strip electrodes and with wide medial sections | Michael Gregory Brown, Louis A. Koszi | 2003-11-04 |
| 6413839 | Semiconductor device separation using a patterned laser projection | Michael Gregory Brown, Mark Gottfried, Robert F. Karlicek, Jr., James Nering | 2002-07-02 |