Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12349433 | Transistors with self-aligned source-connected field plates | Bernhard Grote, Philippe Renaud, Humayun Kabir, Bruce M. Green | 2025-07-01 |
| 12336254 | Semiconductor device with conductive elements formed over dielectric layers and method of fabrication therefor | Bernhard Grote, Humayun Kabir, Bruce M. Green | 2025-06-17 |
| 12327778 | Transistor die with primary and ancillary transistor elements | Humayun Kabir, Bruce M. Green | 2025-06-10 |
| 12191383 | Semiconductor device with an insulating region formed between a control electrode and a conductive element and method of fabrication therefor | Bruce M. Green, Bernhard Grote | 2025-01-07 |
| 12159845 | Transistor with integrated passive components | Humayun Kabir, Vikas Shilimkar, Kevin Kim | 2024-12-03 |
| 12119300 | Transistor circuits with shielded reference transistors | Humayun Kabir, Daniel J. Lamey, Yu-Ting David Wu | 2024-10-15 |
| 11923424 | Semiconductor device with conductive elements formed over dielectric layers and method of fabrication therefor | Bernhard Grote, Humayun Kabir, Bruce M. Green | 2024-03-05 |
| 11842957 | Amplifier modules and systems with ground terminals adjacent to power amplifier die | Jeffrey K. Jones, Kevin Kim, Freek Egbert van Straten | 2023-12-12 |
| 11804527 | Transistor with center fed gate | Vikas Shilimkar, Kevin Kim, Daniel J. Lamey, Bruce M. Green, Humayun Kabir | 2023-10-31 |
| 11502026 | Transistor with flip-chip topology and power amplifier containing same | Vikas Shilmkar, Ramanujam Srinidhi Embar | 2022-11-15 |
| 11444044 | Transistor die with output bondpad at the input side of the die, and power amplifiers including such dies | Ning Zhu, Darrell G. Hill, Damon G. Holmes | 2022-09-13 |
| 11430743 | Transistor with shield system including multilayer shield structure arrangement | Humayun Kabir, Michele L. Miera, Charles John Lessard | 2022-08-30 |
| 11430874 | Semiconductor device with a crossing region | Humayun Kabir | 2022-08-30 |
| 11387169 | Transistor with I/O ports in an active area of the transistor | Kevin Kim, Humayun Kabir | 2022-07-12 |
| 11302609 | Radio frequency power dies having flip-chip architectures and power amplifier modules containing the same | Charles John Lessard, Jeffrey K. Jones | 2022-04-12 |
| 11121072 | Semiconductor device with isolation structure | Ning Zhu, Jeffrey Spencer Roberts, Damon G. Holmes | 2021-09-14 |
| 11108361 | Integrated multiple-path power amplifier with interdigitated transistors | Hussain H. Ladhani, Humayun Kabir | 2021-08-31 |
| 10826439 | Linearity enhancement of high power amplifiers | Ramanujam Srinidhi Embar, Abdulrhman M. S. Ahmed, Ricardo Uscola | 2020-11-03 |
| 10615510 | Feed structure, electrical component including the feed structure, and module | Hussain H. Ladhani, Henry Andre Christange | 2020-04-07 |
| 10593619 | Transistor shield structure, packaged device, and method of manufacture | Charles John Lessard, Damon G. Holmes, Hernan Rueda | 2020-03-17 |
| 10422033 | Green method for coating a substrate with silver nanoparticles | Mutasim Ibrahim Khalil | 2019-09-24 |
| 10147686 | Transistor with shield structure, packaged device, and method of manufacture | Charles John Lessard, Damon G. Holmes, David C. Burdeaux, Hernan Rueda | 2018-12-04 |
| 10103233 | Transistor die with drain via arrangement, and methods of manufacture thereof | David C. Burdeaux, Damon G. Holmes, Hernan Rueda, Partha Chakraborty | 2018-10-16 |
| 9800213 | Amplifier devices with impedance matching networks that incorporate a capacitor integrated with a bond pad | Ebrahim M. Al Seragi, Jeffrey K. Jones | 2017-10-24 |
| 9653410 | Transistor with shield structure, packaged device, and method of manufacture | Damon G. Holmes, David C. Burdeaux, Partha Chakraborty, Hernan Rueda | 2017-05-16 |