| 12125742 |
Package comprising a substrate with high density interconnects |
Kun Fang, Jaehyun Yeon, Suhyung Hwang |
2024-10-22 |
| 12126071 |
Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methods |
Jaehyun Yeon, Kun Fang, Suhyung Hwang |
2024-10-22 |
| 11869833 |
Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the same |
Kun Fang, Jaehyun Yeon, Suhyung Hwang |
2024-01-09 |
| 11439008 |
Package with substrate comprising variable thickness solder resist layer |
Kun Fang, Jaehyun Yeon, Suhyung Hwang, Boyu Tseng |
2022-09-06 |
| 8471686 |
Remote control apparatus with dialing scheme providing haptic sensations |
Wanjoo Park, Laehyun Kim, Sehyung Park, Seungjae Shin |
2013-06-25 |
| 8176057 |
Assessment of a user reputation and a content reliability |
Laehyun Kim, Yo-Sub Han, Jeong Won Cha, Lisa Wiyartanti |
2012-05-08 |