Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10581183 | High speed board to board connection device | Thomas G. Premo, Harold Keith Lang | 2020-03-03 |
| 9431317 | Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package | Yongguo Chen, David A. Holtzclaw, Wei Qi, Benjamin L. Davis, John MacKay | 2016-08-30 |