Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053371 | Apparatus and methods for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Todd A. Dobson, Brian F. Gordon | 2011-11-08 |
| 7449368 | Technique for attaching die to leads | — | 2008-11-11 |
| 7307353 | Technique for attaching die to leads | — | 2007-12-11 |
| 7244681 | Methods for selective removal of material from wafer alignment marks | Guy F. Hudson, Todd A. Dobson, Brian F. Gordon, Russell C. Zahorik | 2007-07-17 |
| 7135763 | Technique for attaching die to leads | — | 2006-11-14 |
| 6889698 | Apparatus for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Todd A. Dobson, Brian F. Gordon | 2005-05-10 |
| 6882032 | Technique for attaching die to leads | — | 2005-04-19 |
| 6828227 | Method for applying uniform pressurized film across wafer | Guy T. Blalock, Lynn J. Carroll | 2004-12-07 |
| 6693034 | Deadhesion method and mechanism for wafer processing | Guy T. Blalock, Brian F. Gordon | 2004-02-17 |
| 6656402 | Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Brian F. Gordon | 2003-12-02 |
| 6653722 | Method for applying uniform pressurized film across wafer | Guy T. Blalock, Lynn J. Carroll | 2003-11-25 |
| 6645345 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Brian F. Gordon | 2003-11-11 |
| 6624089 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Brian F. Gordon | 2003-09-23 |
| 6610610 | Methods for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Todd A. Dobson, Brian F. Gordon | 2003-08-26 |
| 6555897 | Assembly for attaching die to leads | — | 2003-04-29 |
| 6530113 | Apparatus for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Todd A. Dobson, Brian F. Gordon | 2003-03-11 |
| 6518172 | Method for applying uniform pressurized film across wafer | Guy T. Blalock, Lynn J. Carroll | 2003-02-11 |
| 6506679 | Deadhesion method and mechanism for wafer processing | Guy T. Blalock, Brian F. Gordon | 2003-01-14 |
| 6472725 | Technique for attaching die to leads | — | 2002-10-29 |
| 6429146 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Brian F. Gordon | 2002-08-06 |
| 6410459 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Brian F. Gordon | 2002-06-25 |
| 6380086 | High-speed planarizing apparatus for chemical-mechanical planarization of semiconductor wafers | Karl M. Robinson | 2002-04-30 |
| 6329301 | Method and apparatus for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Todd A. Dobson, Brian F. Gordon | 2001-12-11 |
| 6316363 | Deadhesion method and mechanism for wafer processing | Guy T. Blalock, Brian F. Gordon | 2001-11-13 |
| 6309913 | Technique for attaching die to leads | — | 2001-10-30 |