Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8835220 | Backside mold process for ultra thin substrate and package on package assembly | Choong Kooi Chee, Kein Fee Liew | 2014-09-16 |
| 8384223 | Backside mold process for ultra thin substrate and package on package assembly | Choong Kooi Chee, Kein Fee Liew | 2013-02-26 |