HL

Hsi-Kai Lo

UM United Microelectronics: 1 patents #2,686 of 4,560Top 60%
Overall (All Time): #2,565,214 of 4,157,543Top 65%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11569150 Semiconductor bonding pad device and method for forming the same Ming-Hung Lai 2023-01-31