Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11273515 | Bonding process with rotating bonding stage | Yuji Komagino, Hideki Yoshino | 2022-03-15 |
| 11173567 | Bonding apparatus with rotating bonding stage | Yuji Komagino, Hideki Yoshino | 2021-11-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11273515 | Bonding process with rotating bonding stage | Yuji Komagino, Hideki Yoshino | 2022-03-15 |
| 11173567 | Bonding apparatus with rotating bonding stage | Yuji Komagino, Hideki Yoshino | 2021-11-16 |