Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11273515 | Bonding process with rotating bonding stage | Hodaka Yamaguchi, Hideki Yoshino | 2022-03-15 |
| 11173567 | Bonding apparatus with rotating bonding stage | Hodaka Yamaguchi, Hideki Yoshino | 2021-11-16 |