Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5414214 | Resistance heated, sealed microfabricated device package method and apparatus | Frederick Y. Cho, Michael J. Anderson | 1995-05-09 |
| 5406034 | Circuit board having stepped vias | John K. Frei, Bruce R. Tegge | 1995-04-11 |
| 5361967 | Monolithic circuit fabrication method | Michael J. Anderson, Wayne D. Pasco | 1994-11-08 |
| 5341115 | Reinforced wrap around ground and method | John K. Frei | 1994-08-23 |
| 5296736 | Leveled non-coplanar semiconductor die contacts | John K. Frei, Bruce R. Tegge | 1994-03-22 |
| 4601915 | Method of fabricating air supported crossovers | Donald E. Allen, Richard A. Gross | 1986-07-22 |