Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5406034 | Circuit board having stepped vias | Howard D. Knuth, Bruce R. Tegge | 1995-04-11 |
| 5401689 | Method for forming a semiconductor chip carrier | Kenneth Brice-Heames | 1995-03-28 |
| 5345056 | Plasma based soldering by indirect heating | Russell T. Fiorenzo | 1994-09-06 |
| 5342999 | Apparatus for adapting semiconductor die pads and method therefor | Kenneth Brice-Heames | 1994-08-30 |
| 5341115 | Reinforced wrap around ground and method | Howard D. Knuth | 1994-08-23 |
| 5296736 | Leveled non-coplanar semiconductor die contacts | Howard D. Knuth, Bruce R. Tegge | 1994-03-22 |
| 5223691 | Plasma based soldering method requiring no additional heat sources or flux | Russell T. Fiorenzo | 1993-06-29 |