Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7459118 | Heated medium supplying method and structure for secondary molding of resin molded component | Akira Kuroyanagi, Masato Ichikawa, Akira Sahashi | 2008-12-02 |
| 7438842 | Method of manufacturing resin molding and change-over device for changing over between heating medium and resin material in process of secondary forming | Akira Kuroyanagi, Masato Ichikawa, Akira Sahashi | 2008-10-21 |
| 7405107 | Semiconductor device, method and apparatus for fabricating the same | Shusaku Nakazawa, Tsutomu Onoue, Hiroaki Mizuno | 2008-07-29 |
| 7300274 | Change-over device for changing over between a heating medium and a resin material at a time of a secondary forming | Akira Kuroyanagi, Masato Ichikawa, Akira Sahashi | 2007-11-27 |