HM

Hiroaki Makabe

SC Sumitomo Bakelite Co.: 8 patents #24 of 790Top 4%
PR Promerus: 3 patents #51 of 140Top 40%
Sumitomo Electric Industries: 1 patents #13,249 of 21,551Top 65%
Overall (All Time): #419,066 of 4,157,543Top 15%
12
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9261781 Preparation of norbornane-based PAC ballasts Andrew Bell, Keitaro Seto 2016-02-16
8530119 Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor device and display element using the same Takashi Hirano, Toshio Banba, Shusaku Okamyo 2013-09-10
8530133 Preparation of norbornane-based PAC ballasts Andrew Bell, Keitaro Seto, Edmund Elce 2013-09-10
8440734 Positive photosensitive resin composition, cured film, protecting film, insulating film, and semiconductor device and display device using the same Hiromichi Sugiyama 2013-05-14
7858721 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films Dino Amoroso, Brian Bedwell, Andrew Bell, Edmund Elce, Rajesh Raja Puthenkovilakom +7 more 2010-12-28
7781131 Positive photosensitive resin composition, cured layer , protecting layer, insulating layer and semiconductor device and display therewith 2010-08-24
7524594 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films Dino Amoroso, Brian Bedwell, Andrew Bell, Edmund Elce, Rajesh Raja Puthenkovilakom +7 more 2009-04-28
6927013 Positive photosensitive resin compositions and semiconductor device Toshio Banba, Takashi Hirano 2005-08-09
6607865 Positive photosensitive resin composition Toshio Banba, Takashi Hirano 2003-08-19
6576381 Semiconductor device Takashi Hirano, Kagehisa Yamamoto, Toshio Banba 2003-06-10
6235436 Semiconductor device using positive photosensitive resin composition and process for preparation thereof Takashi Hirano, Toshio Banba, Naoshige Takeda, Toshiro Takeda 2001-05-22
6071666 Positive type photosensitive resin composition and semiconductor device using the same Takashi Hirano, Toshio Banba, Naoshige Takeda, Toshiro Takeda 2000-06-06