Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8534275 | Wire saw device | Masaki Fukuda, Ryouji Shindou | 2013-09-17 |
| 8251778 | Double-side grinding apparatus for wafer and double-side grinding method | — | 2012-08-28 |
| 7494597 | Method and apparatus for etching disk-like member | Tadamitsu Miyazaki, Kazuya Hirayama, Hisaya Fukunaga | 2009-02-24 |