Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081374 | Semiconductor package molding device and method of manufacturing semiconductor device | Jae Won Choi, Sung-Bok Hong, Young Jin Hwang | 2021-08-03 |
| 7501590 | Molding resin tablet feeding apparatus having weighing unit | Ok-Sun Jung, Hee-Chul Kang, Byong-Do Na, Young Jin Hwang, Do-Woo Lee +1 more | 2009-03-10 |